Solder paste – kontakt
Mild, ready for direct use, non corroding flux of paste consistence, made on the base of rosin and organic activating additives from chlorine free compounds.
Applied in electrical and electronic engineering (also for printed circuits). Remnants of the paste after soldering cause no corrosion and may remain on welds.
Weight: 20 g.
Item No.: 370-562800.
Wires with flux for soft soldering, DW 60 type
Applied for high quality joints in electrical and electronic engineering.
Melting-point: 183 °C.
Soldering temperature: 248 °C.
Wire weight on spool: 0,25 kg.
| Type | Wire diameter | Alloy of | Item No. |
| DW 0,25/SnCu | 0,25 | 99% Sn, 1% Cu | E05ML-01010100101 |
| DW 0,38/SnCu | 0,38 | E05ML-01010100201 | |
| DW 0,50/SnCu | 0,50 | E05ML-01010100301 | |
| DW 0,56/SnCu | 0,56 | E05ML-01010100401 | |
| DW 0,70/SnCu | 0,70 | E05ML-01010100501 | |
| DW 0,90/SnCu | 0,90 | E05ML-01010100601 | |
| DW 1,00/SnCu | 1,00 | E05ML-01010100701 | |
| DW 2,00/SnCu | 2,00 | E05ML-01010100801 | |
| DW 1,00/SnAg (*) | 1,00 | 96% Sn, 4% Ag | E05ML-01010200901 |
| DW 0,25/TLR | 0,25 | 60% Sn; 40% Pb. | E05ML-01010200101 |
| DW 0,38/TLR | 0,38 | E05ML-01010200201 | |
| DW 0,50/TLR | 0,50 | E05ML-01010200301 | |
| DW 0,56/TLR | 0,56 | E05ML-01010200401 | |
| DW 0,70/TLR | 0,70 | E05ML-01010200501 | |
| DW 0,90/TLR | 0,90 | E05ML-01010200601 | |
| DW 1,00/TLR | 1,00 | E05ML-01010200701 | |
| DW 2,00/TLR | 2,00 | E05ML-01010200801 |